RDK-160【PDF 15/18 页】KIT REF DESIGN LINKSWITCH 2

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Sheet目录1238

11页 12页 13页 14页 [15页]16页 17页 18页

LNK603-606/613-616

DIP-8C (P Package)

-E-

⊕ D S

.004 (.10)

Notes:

1. Package dimensions conform to JEDEC specification

MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)

package with .300 inch row spacing.

2. Controlling dimensions are inches. Millimeter sizes are

shown in parentheses.

.240 (6.10)

.260 (6.60)

Pin 1

3. Dimensions shown do not include mold flash or other

protrusions. Mold flash or protrusions shall not exceed

.006 (.15) on any side.

4. Pin locations start with Pin 1, and continue counter-clock-

wise to Pin 8 when viewed from the top. The notch and/or

dimple are aids in locating Pin 1. Pin 3 is omitted.

5. Minimum metal to metal spacing at the package body for

-D-

.367 (9.32)

.387 (9.83)

.057 (1.45)

.068 (1.73)

the omitted lead location is .137 inch (3.48 mm).

6. Lead width measured at package body.

7. Lead spacing measured with the leads constrained to be

perpendicular to plane T.

(NOTE 6)

.125 (3.18)

.145 (3.68)

.015 (.38)

MINIMUM

-T-

SEATING

PLANE

.120 (3.05)

.140 (3.56)

.008 (.20)

.015 (.38)

.100 (2.54) BSC

.014 (.36)

.022 (.56)

.048 (1.22) .137 (3.48)

⊕ T E D S .010 (.25) M

.053 (1.35) MINIMUM

.300 (7.62) BSC

(NOTE 7)

.300 (7.62)

.390 (9.91)

P08C

PI-3933-101507

SMD-8C (G Package)

-E-

⊕ D S .004 (.10)

.046 .060

.060 .046

.080

Notes:

1. Controlling dimensions are

inches. Millimeter sizes are

shown in parentheses.

2. Dimensions shown do not

include mold flash or other

.086

protrusions. Mold flash or

.240 (6.10)

.260 (6.60)

.372 (9.45)

.388 (9.86)

⊕ E S .010 (.25)

.186

.286

.420

protrusions shall not exceed

.006 (.15) on any side.

3. Pin locations start with Pin 1,

and continue counter-clock-

wise to Pin 8 when viewed

from the top. Pin 3 is omitted.

4. Minimum metal to metal

Pin 1

Pin 1

spacing at the package body

for the omitted lead location

-D-

.100 (2.54) (BSC)

.367 (9.32)

.387 (9.83)

.137 (3.48)

MINIMUM

Solder Pad Dimensions

is .137 inch (3.48 mm).

5. Lead width measured at

package body.

6. D and E are referenced

datums on the package

body.

.057 (1.45)

.125 (3.18)

.145 (3.68)

.068 (1.73)

(NOTE 5)

.032 (.81)

.037 (.94)

.048 (1.22)

.053 (1.35)

.009 (.23)

.004 (.10)

.012 (.30)

.004 (.10)

.036 (0.91)

.044 (1.12)

0 ° - 8 °

G08C

PI-4015-101507

15

www.powerint.com

Rev. F 01/10

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